News & Events

1802_FTS-AGV-591
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

DYCONEX at S.E.E. 2018

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Scandinavian Electronics Event
April 24 - 26, 2018
Kistamässan Science Citx, Kista/Stockholm, Sweden
Hall C, Booth# C11:33

DYCONEX at EMPS workshop

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Electronic Materials & Processes for Space (EMPS) Workshop

April 25 - 26, 2018
Y-Parc, Yverdon-les-Bains, Switzerland

Presentation by Bernhard Schmuki: 

Ultra-thin rigid PCBs with highly reliable anylayer and HDI build-ups

DYCONEX at ILA 2018

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Trade Show for Aviation, Defense & Security and Space
April 25 - 27, 2018
ExpoCenter Airport, Berlin, Germany
Hall 6 - International Suppliers Center (ISC), Booth# 424 

Details on DYCONEX presence

DYCONEX at SMT 2018

SMT HYBRID PACKAGING 2017

SMT/HYBRID/PACKAGING
June 5 - 7, 2018
Messezentrum Nuremberg, Germany
Hall 5, Booth# 211-C


DYCONEX buys CO2/UV Laser equipment

DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.

The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.

Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.

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