DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Manufacturing Processes for Medical Technology
September 9 - 11, 2014
Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA
DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.
The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.
Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.
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DYCONEX AG, CH-8303 Bassersdorf, Switzerland