DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.
RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK
Leading European trade show for medical manufacturing industry
April 21 - 23, 2015
Messe Stuttgart, Germany
Hall 3, Booth# E28
Medical Device Manufacturing & Design Technology
April 22 - 24, 2015
Tokyo Big Sight, Tokyo, Japan
Swiss Medtech Pavilion
7th International IEEE EMBS Neural Engineering Conference
April 22-24, 2015
The Corum, Montpellier, France
A poster presentation will be held about the theme:
Complex, multilayer liquid crystal polymer lead structures qualified for direct biocompatible implants
DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.
The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.
Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland