News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at IMAPS Device Packaging 2017 - USA

IMAPS
Device Packaging
March 7 - 8, 2017
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Booth# 14

MST at MEDTEC Europe 2017

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 4 - 6, 2017
Messe Stuttgart, Germany
Swiss Pavilion Booth# 1L28

MST at MEDTEC Japan 2017

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Medical Device Manufacturing & Design Technology
April 19 - 21, 2017
Tokyo Big Sight, Tokyo, Japan
Swiss Pavilion


DYCONEX buys CO2/UV Laser equipment

DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.

The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.

Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.

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