News & Events


DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

DYCONEX at electronica 2016


Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
Hall C4, booth# 610

At the PCB & Components Marketplace Forum, Bernhard Schmuki, Field Application Engineer at DYCONEX, will present a recent product development and its impact on new applications under the theme: “More functionality thanks to ultra-thin materials”.

You are welcome to attend his speech on Thursday, November 10 at 4.30 pm, hall B4, booth# 365.



High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at IMAPS Technology Workshop Lyon 2016 - France

Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France

DYCONEX buys CO2/UV Laser equipment

DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.

The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.

Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.