News & Events

06.06.2014

DYCONEX qualifies new Multibond process for high-reliability PCBs

DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.

MST at Medical Electronics Symposium 2014

medical_electronics_conference_108px

Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA

MST at IMAPS 2014 - USA

IMAPS
Microelectronics
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
Booth# 335

MST at Neurotech Leaders Forum 2014

neurotech_leaders_forum_108px

Neurotechnology Industry 
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA


DYCONEX buys CO2/UV Laser equipment

DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.

The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.

Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.

1209_hitachi_laser