DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.
DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.
June 13, 2017
Kursaal, Berne, Switzerland
Medical Design & Manufacturing
June 13 - 15, 2017
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 2163
52nd International Paris Air Show
June 19-25, 2017
Le Bourget, Paris
HAll 4, Booth# D193
DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.
The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.
Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland