DYCONEX AG, an MST company and the world's leading supplier of highly complex circuit board solutions, has made a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH.
Microelectronics, Systems & Packaging
November 25 - 26, 2015
Metropole Hotel, Lyon, France
Medical Design & Manufacturing
February 9 - 11, 2016
Convention Center Anaheim, CA, USA
Hall E, Booth# 510
B2B Forum for Medical Devices Industry
February 24 - 25, 2016
Liederhalle, Stuttgart, Germany
DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.
The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.
Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland