News & Events

dyconex_ist_labor
01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

en9100_logo
08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at International Symposium on Microelectronics 2017, USA

IMAPS
Microelectronics
October 10 - 11, 2017
Raleigh, NC, USA
Booth# 325

DYCONEX at European Microwave Week 2017

EuMweek_2017

Europe's Premier Microwave, RF, Wireless and Radar Event
October 10 - 12, 2017
Exhibiting Center Nuremberg, Germany
Hall G85, Booth# 307

DYCONEX at Airtec 2017

Airtec

The global aerospace supply chain in one place
October 24 - 26, 2017
AeroExpoPark next to Munich Airport, Germany
Booth# G85


DYCONEX buys CO2/UV Laser equipment

DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.

The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.

Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.

1209_hitachi_laser