DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.
Measuring, Testing, Monitoring
June 26 - 28, 2018
Messezentrum Nuremberg, Germany
Hall 1, Booth# 538
September 12, 2018
Convention Center, Santa Clara, CA, USA
Conference on electronics and systemintegration technology
September 18 - 20, 2018
The Westin Bellevue Hotel, Dresden, Germany
Presentation by Dr. Eckardt Bihler
Hermetic LCP modules with NFC communication
DYCONEX has again invested in additional laser drill equipment. The new CO2/UV Combi-Laser considerably increases throughput for HDI PCBs and improves especially the quality of blind vias.
The new Combi-Laser system significantly boosts the productivity of blind via formation for rigid substrates. Blind microvias are produced considerably faster compared to conventional UV laser drilling. The new system is equipped with an automatic loading and unloading station enabling further automation.
Quality improvements are heavily linked to the selective ablation rates of the two laser systems (UV and CO2). The CO2 laser's specific strength is the consistent and complete via opening in inhomogeneous glass-reinforced dielectrics due to its better absorption properties in glass fibers. Furthermore, it features significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through.
© 2018 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland