DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Development, Manufacturing and Use of passive & active implants
April 28 - 29, 2014
Congress Centre Kursaal, Interlaken, Switzerland
May 6- 8, 2014
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth# 428
DYCONEX is pleased to invite you to visit us at the SPIE Defense, Security + Sensing 2012. SPIE is the world's largest unclassified exhibition for defense, security, and sensing applications for industry and the environment. The event will take place April 24-26 in Baltimore, Maryland.
DYCONEX will exhibit its solutions in ultra-HDI interconnect, 3-D miniaturization and high-frequency flex PCB.
Our exhibition staff is looking forward to meeting you at booth #314.
Please feel free to contact us to arrange an appointment to discuss your application at the show.
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland