DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA
DYCONEX is pleased to invite you to visit us at the SPIE Defense, Security + Sensing 2012. SPIE is the world's largest unclassified exhibition for defense, security, and sensing applications for industry and the environment. The event will take place April 24-26 in Baltimore, Maryland.
DYCONEX will exhibit its solutions in ultra-HDI interconnect, 3-D miniaturization and high-frequency flex PCB.
Our exhibition staff is looking forward to meeting you at booth #314.
Please feel free to contact us to arrange an appointment to discuss your application at the show.
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland