News & Events
DYCONEX qualifies new Multibond process for high-reliability PCBs
DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
MST at Medical Manufacturing Asia 2014
Manufacturing Processes for Medical Technology
September 9 - 11, 2014
Suntec, Singapore
Booth# 4E20
MST at Medical Electronics Conference 2014
Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA
DYCONEX at the SPIE Defense, Security + Sensing 2012 in Baltimore, USA
DYCONEX is pleased to invite you to visit us at the SPIE Defense, Security + Sensing 2012. SPIE is the world's largest unclassified exhibition for defense, security, and sensing applications for industry and the environment. The event will take place April 24-26 in Baltimore, Maryland.
DYCONEX will exhibit its solutions in ultra-HDI interconnect, 3-D miniaturization and high-frequency flex PCB.
Our exhibition staff is looking forward to meeting you at booth #314.
Please feel free to contact us to arrange an appointment to discuss your application at the show.
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DYCONEX AG, CH-8303 Bassersdorf, Switzerland