DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
March 11 - 12, 2014
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA
Medical Device & Biopharma Design and Manufacturing
March 26 - 27, 2014
Convention & Exhibition Center, Boston, MA, USA
DYCONEX is pleased to invite you to visit us at the SPIE Defense, Security + Sensing 2012. SPIE is the world's largest unclassified exhibition for defense, security, and sensing applications for industry and the environment. The event will take place April 24-26 in Baltimore, Maryland.
DYCONEX will exhibit its solutions in ultra-HDI interconnect, 3-D miniaturization and high-frequency flex PCB.
Our exhibition staff is looking forward to meeting you at booth #314.
Please feel free to contact us to arrange an appointment to discuss your application at the show.
© 2013 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland