DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.
DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.
Microelectronics & Packaging
September 10 - 13, 2017
University of Technology, Warsaw, Poland
September 13, 2017
Convention Center, Santa Clara, CA, USA
October 10 - 11, 2017
Raleigh, NC, USA
DYCONEX is pleased to invite you to visit us at the SPIE Defense, Security + Sensing 2012. SPIE is the world's largest unclassified exhibition for defense, security, and sensing applications for industry and the environment. The event will take place April 24-26 in Baltimore, Maryland.
DYCONEX will exhibit its solutions in ultra-HDI interconnect, 3-D miniaturization and high-frequency flex PCB.
Our exhibition staff is looking forward to meeting you at booth #314.
Please feel free to contact us to arrange an appointment to discuss your application at the show.
© 2017 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland