News & Events

11.02.2014

DYCONEX adds Ticer TCR-HF foils to its range of circuit board technologies

DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.  

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2014 - USA

IMAPS
Device Packaging
March 11 - 12, 2014
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA
Booth# 25

MST at BIOMEDevice Boston 2014

BIOMEDevice

Medical Device & Biopharma Design and Manufacturing
March 26 - 27, 2014
Convention & Exhibition Center, Boston, MA, USA
Booth# 900

DYCONEX at the SPIE Defense, Security + Sensing 2012 in Baltimore, USA

DYCONEX is pleased to invite you to visit us at the SPIE Defense, Security + Sensing 2012. SPIE is the world's largest unclassified exhibition for defense, security, and sensing applications for industry and the environment. The event will take place April 24-26 in Baltimore, Maryland.

DYCONEX will exhibit its solutions in ultra-HDI interconnect, 3-D miniaturization and high-frequency flex PCB.

Our exhibition staff is looking forward to meeting you at booth #314.

Please feel free to contact us to arrange an appointment to discuss your application at the show.