News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at EMPC - European Microelectronics & Packaging Conference 2017

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Microelectronics & Packaging
September 10 - 13, 2017
University of Technology, Warsaw, Poland
Booth# tbd

DYCONEX at PCB West 2017

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PCB Industry
September 13, 2017
Convention Center, Santa Clara, CA, USA
Booth# 200

MST at International Symposium on Microelectronics 2017, USA

IMAPS
Microelectronics
October 10 - 11, 2017
Raleigh, NC, USA
Booth# 325


DYCONEX at the SPIE Defense, Security + Sensing 2012 in Baltimore, USA

DYCONEX is pleased to invite you to visit us at the SPIE Defense, Security + Sensing 2012. SPIE is the world's largest unclassified exhibition for defense, security, and sensing applications for industry and the environment. The event will take place April 24-26 in Baltimore, Maryland.

DYCONEX will exhibit its solutions in ultra-HDI interconnect, 3-D miniaturization and high-frequency flex PCB.

Our exhibition staff is looking forward to meeting you at booth #314.

Please feel free to contact us to arrange an appointment to discuss your application at the show.