June 4 - 6, 2013
Washington State Convention & Trade Center, Seattle, WA, USA
DYCONEX is pleased to announce the addition of scanning electron microscopy (SEM) to its service offerings. Scanning electron microscope images have a large depth of field and are high resolution, which allows for greater resolution and magnification of closely-spaced, complex features.
The new SEM capability is used to provide enhanced quality inspection of Ultra-HDI circuit board technology as well as for advanced research analysis, such as micro-topography measurement, materials and failure analysis.
© 2011 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Basserdorf, Switzerland