DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.
DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.
Leading European trade show for medical manufacturing industry
April 4 - 6, 2017
Messe Stuttgart, Germany
Swiss Pavilion Booth# 1L28
Medical Device Manufacturing & Design Technology
April 19 - 21, 2017
Tokyo Big Sight, Tokyo, Japan
May 16 - 18, 2017
Messezentrum Nuremberg, Germany
DYCONEX: Hall 5, Booth# 5-321
DYCONEX is pleased to announce the addition of scanning electron microscopy (SEM) to its service offerings. Scanning electron microscope images have a large depth of field and are high resolution, which allows for greater resolution and magnification of closely-spaced, complex features.
The new SEM capability is used to provide enhanced quality inspection of Ultra-HDI circuit board technology as well as for advanced research analysis, such as micro-topography measurement, materials and failure analysis.
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland