News & Events

11.02.2014

DYCONEX adds Ticer TCR-HF foils to its range of circuit board technologies

DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.  

MST at [MEET THE EXPERT] IMPLANTS 2014

meet_the_expert_108px

Development, Manufacturing and Use of passive & active implants
April 28 - 29, 2014
Congress Centre Kursaal, Interlaken, Switzerland

DYCONEX at SMT 2014

SMT

SMT/HYBRID/PACKAGING
May 6- 8, 2014
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth# 428


DYCONEX invests in state-of-the art SEM microscope

DYCONEX is pleased to announce the addition of scanning electron microscopy (SEM) to its service offerings. Scanning electron microscope images have a large depth of field and are high resolution, which allows for greater resolution and magnification of closely-spaced, complex features.

The new SEM capability is used to provide enhanced quality inspection of Ultra-HDI circuit board technology as well as for advanced research analysis, such as micro-topography measurement, materials and failure analysis.