DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA
DYCONEX is pleased to announce the addition of scanning electron microscopy (SEM) to its service offerings. Scanning electron microscope images have a large depth of field and are high resolution, which allows for greater resolution and magnification of closely-spaced, complex features.
The new SEM capability is used to provide enhanced quality inspection of Ultra-HDI circuit board technology as well as for advanced research analysis, such as micro-topography measurement, materials and failure analysis.
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland