DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
March 11 - 12, 2014
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA
Medical Device & Biopharma Design and Manufacturing
March 26 - 27, 2014
Convention & Exhibition Center, Boston, MA, USA
DYCONEX is pleased to announce the addition of scanning electron microscopy (SEM) to its service offerings. Scanning electron microscope images have a large depth of field and are high resolution, which allows for greater resolution and magnification of closely-spaced, complex features.
The new SEM capability is used to provide enhanced quality inspection of Ultra-HDI circuit board technology as well as for advanced research analysis, such as micro-topography measurement, materials and failure analysis.
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DYCONEX AG, CH-8303 Bassersdorf, Switzerland