News & Events

1802_FTS-AGV-591
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

DYCONEX at S.E.E. 2018

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Scandinavian Electronics Event
April 24 - 26, 2018
Kistamässan Science Citx, Kista/Stockholm, Sweden
Hall C, Booth# C11:33

DYCONEX at EMPS workshop

EMPS-9

Electronic Materials & Processes for Space (EMPS) Workshop

April 25 - 26, 2018
Y-Parc, Yverdon-les-Bains, Switzerland

Presentation by Bernhard Schmuki: 

Ultra-thin rigid PCBs with highly reliable anylayer and HDI build-ups

DYCONEX at ILA 2018

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Trade Show for Aviation, Defense & Security and Space
April 25 - 27, 2018
ExpoCenter Airport, Berlin, Germany
Hall 6 - International Suppliers Center (ISC), Booth# 424 

Details on DYCONEX presence

DYCONEX at SMT 2018

SMT HYBRID PACKAGING 2017

SMT/HYBRID/PACKAGING
June 5 - 7, 2018
Messezentrum Nuremberg, Germany
Hall 5, Booth# 211-C


DYCONEX announces new Laser Directly Imaging capability

DYCONEX has recently qualified and released to production its Paragon Ultra 200 Laser Direct Imaging (LDI) tool. This is the latest generation of exposure tools from Orbotech featuring maximum resolution and registration performance.

Artwork generation with Laser Direct Imaging systems gives both DYCONEX and its customers significant advantages over conventional exposure tools using film masters. The turnaround time for layer structuring has proven to be less than half, while expenses for consumables such as film materials are reduced.

Additional major benefits of LDI technology include the ability to improve layer registration, implement individual compensation correction per panel as well as perform step-by-step registration. These give our customers the flexibility to further tighten the requirements on annular rings and thus increases interconnect density. DYCONEX has demonstrated the Ultra 200 system operating at better than 5-micron layer-to-layer accuracy.

In combination with improved registration, the ultra-high resolution capability of the Paragon Ultra 200 enables DYCONEX to meet the future requirements of our customers. The production yield of features with lines and spaces of 20 microns and below is significantly improved. Going a step further, DYCONEX already demonstrated imaging capabilities down to 8-micron lines and 12-micron spaces.

Last but not least, DYCONEX offers full traceability of production panels throughout the entire manufacturing flow by individually numbering panels with LDI. This gives customers further options in monitoring and controlling their own manufacturing process.