DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
Hall C4, booth# 610
At the PCB & Components Marketplace Forum, Bernhard Schmuki, Field Application Engineer at DYCONEX, will present a recent product development and its impact on new applications under the theme: “More functionality thanks to ultra-thin materials”.
You are welcome to attend his speech on Thursday, November 10 at 4.30 pm, hall B4, booth# 365.
High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France
DYCONEX has recently qualified and released to production its Paragon Ultra 200 Laser Direct Imaging (LDI) tool. This is the latest generation of exposure tools from Orbotech featuring maximum resolution and registration performance.
Artwork generation with Laser Direct Imaging systems gives both DYCONEX and its customers significant advantages over conventional exposure tools using film masters. The turnaround time for layer structuring has proven to be less than half, while expenses for consumables such as film materials are reduced.
Additional major benefits of LDI technology include the ability to improve layer registration, implement individual compensation correction per panel as well as perform step-by-step registration. These give our customers the flexibility to further tighten the requirements on annular rings and thus increases interconnect density. DYCONEX has demonstrated the Ultra 200 system operating at better than 5-micron layer-to-layer accuracy.
In combination with improved registration, the ultra-high resolution capability of the Paragon Ultra 200 enables DYCONEX to meet the future requirements of our customers. The production yield of features with lines and spaces of 20 microns and below is significantly improved. Going a step further, DYCONEX already demonstrated imaging capabilities down to 8-micron lines and 12-micron spaces.
Last but not least, DYCONEX offers full traceability of production panels throughout the entire manufacturing flow by individually numbering panels with LDI. This gives customers further options in monitoring and controlling their own manufacturing process.
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland