News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

MST at Medical Electronics Symposium 2015

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Microelectronics
September 16 - 17, 2015
Marylhurst University, Portland, OR, USA

DYCONEX at PCB West 2015

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PCB Industry
September 15 - 17, 2015
Convention Center, Santa Clara, CA, USA

DYCONEX at 23. FED-Conference



PCB Industry
September 24 - 26, 2015
Hotel Grand La Strada, Kassel, DE

MST at International Symposium on Microelectronics 2015, USA

IMAPS
Microelectronics
October 27 - 28, 2015
Rosen Centre Hotel, Orlando, FL, USA
Booth# 707


DYCONEX announces new Laser Directly Imaging capability

DYCONEX has recently qualified and released to production its Paragon Ultra 200 Laser Direct Imaging (LDI) tool. This is the latest generation of exposure tools from Orbotech featuring maximum resolution and registration performance.

Artwork generation with Laser Direct Imaging systems gives both DYCONEX and its customers significant advantages over conventional exposure tools using film masters. The turnaround time for layer structuring has proven to be less than half, while expenses for consumables such as film materials are reduced.

Additional major benefits of LDI technology include the ability to improve layer registration, implement individual compensation correction per panel as well as perform step-by-step registration. These give our customers the flexibility to further tighten the requirements on annular rings and thus increases interconnect density. DYCONEX has demonstrated the Ultra 200 system operating at better than 5-micron layer-to-layer accuracy.

In combination with improved registration, the ultra-high resolution capability of the Paragon Ultra 200 enables DYCONEX to meet the future requirements of our customers. The production yield of features with lines and spaces of 20 microns and below is significantly improved. Going a step further, DYCONEX already demonstrated imaging capabilities down to 8-micron lines and 12-micron spaces.

Last but not least, DYCONEX offers full traceability of production panels throughout the entire manufacturing flow by individually numbering panels with LDI. This gives customers further options in monitoring and controlling their own manufacturing process.