EIPC Winter Conference
February 5-6, 2015
Hotel NH Munich Airport, Munich, Germany
Dr. Hans-Peter Klein will give a presentation
about the theme:
Flex PCB Reliability - The proof of evidence
It will take place on Thursday, February 5, 11:25hrs
Medical Design & Manufacturing
February 10 - 12, 2015
Convention Center Anaheim, CA, USA
Hall E, Booth# 518
March 17 - 18, 2015
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA
DYCONEX has recently qualified and released to production its Paragon Ultra 200 Laser Direct Imaging (LDI) tool. This is the latest generation of exposure tools from Orbotech featuring maximum resolution and registration performance.
Artwork generation with Laser Direct Imaging systems gives both DYCONEX and its customers significant advantages over conventional exposure tools using film masters. The turnaround time for layer structuring has proven to be less than half, while expenses for consumables such as film materials are reduced.
Additional major benefits of LDI technology include the ability to improve layer registration, implement individual compensation correction per panel as well as perform step-by-step registration. These give our customers the flexibility to further tighten the requirements on annular rings and thus increases interconnect density. DYCONEX has demonstrated the Ultra 200 system operating at better than 5-micron layer-to-layer accuracy.
In combination with improved registration, the ultra-high resolution capability of the Paragon Ultra 200 enables DYCONEX to meet the future requirements of our customers. The production yield of features with lines and spaces of 20 microns and below is significantly improved. Going a step further, DYCONEX already demonstrated imaging capabilities down to 8-micron lines and 12-micron spaces.
Last but not least, DYCONEX offers full traceability of production panels throughout the entire manufacturing flow by individually numbering panels with LDI. This gives customers further options in monitoring and controlling their own manufacturing process.
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland