DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.
March 6 - 7, 2018
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, AZ, USA
Conference for the German-speaking aviation and space industry
March 22, 2018
Priora Business Center, Zurich, Switzerland
Please note, the event will mainly be held in German.
DYCONEX has recently qualified and released to production its Paragon Ultra 200 Laser Direct Imaging (LDI) tool. This is the latest generation of exposure tools from Orbotech featuring maximum resolution and registration performance.
Artwork generation with Laser Direct Imaging systems gives both DYCONEX and its customers significant advantages over conventional exposure tools using film masters. The turnaround time for layer structuring has proven to be less than half, while expenses for consumables such as film materials are reduced.
Additional major benefits of LDI technology include the ability to improve layer registration, implement individual compensation correction per panel as well as perform step-by-step registration. These give our customers the flexibility to further tighten the requirements on annular rings and thus increases interconnect density. DYCONEX has demonstrated the Ultra 200 system operating at better than 5-micron layer-to-layer accuracy.
In combination with improved registration, the ultra-high resolution capability of the Paragon Ultra 200 enables DYCONEX to meet the future requirements of our customers. The production yield of features with lines and spaces of 20 microns and below is significantly improved. Going a step further, DYCONEX already demonstrated imaging capabilities down to 8-micron lines and 12-micron spaces.
Last but not least, DYCONEX offers full traceability of production panels throughout the entire manufacturing flow by individually numbering panels with LDI. This gives customers further options in monitoring and controlling their own manufacturing process.
© 2017 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland