DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
Development, Manufacturing and Use of passive & active implants
April 28 - 29, 2014
Congress Centre Kursaal, Interlaken, Switzerland
May 6- 8, 2014
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth# 428
We invite you to visit us at the international Microwave Symposium IEEE MTT-S IMS 2011.The principal international gathering for everyone involved in technologies associated with RF, microwave, millimeter wave, and THz frequencies. The show will be held at the Baltimore Convention Center on June 7-9, 2011.
Take advantage of this great opportunity to learn more about our most recent developments in PCB
technology and service offerings.
More information about the show you will find at: www.ims2011.org
We are looking forward to welcoming you at Booth #744
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland