DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.
We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»

Defense, Security + Sensing
April 24 - 26, 2012
Baltimore Convention Center, Baltimore, MD, USA
Booth# 314

SMT/HYBRID/PACKAGING
May 8 - 10, 2012
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth#428
As a next step towards our integration with the Micro Systems Technologies Group, our US entity DYCONEX Inc. has been transformed into MST Inc. The Company is registered in Oregon but still head-quartered at the former address in Phoenix Arizona. MST Inc. represents the DYCONEX scope of prod-ucts as well as all other offerings of the MST Group.
In this context, we are pleased to announce the appointment of Kevin Walker as the General Manager of Micro Systems Technology Inc. (MST Inc.). As General Manager, Mr. Walker is responsible for grow-ing the overall MST business and in particular DYCONEX's market share in North America. Mr. Walker contributes senior executive experience from both the high-end PCB as well as the base materials industry. Mr. Walker has a proven track record in international sales and holds a BS in Industrial Engineering from Texas Tech University.
About MST:
The MST Group comprises 5 technology companies located in Germany, the United States, and Swit-zerland. The globally active group provides innovative products and services for medical devices, especially implants, and other high-reliability/high-performance industries. The offering includes amongst others HDI/microvia PCBs, ceramic substrates, electronic module design and manufacturing, batteries and hermetic feedthroughs for implants, as well as catheter technology.
© 2011 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Basserdorf, Switzerland