News & Events

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG, an MST company and the world's leading supplier of highly complex solutions in the area of interconnect technology, has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at MD&M West Anaheim 2017

MD&M West

Medical Design & Manufacturing
February 7 - 9, 2017
Convention Center Anaheim, CA, USA
Hall E, Booth# 510

MST at IMAPS Device Packaging 2017 - USA

IMAPS
Device Packaging
March 7 - 8, 2017
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Booth# 14


US ENTITY DYCONEX INC. TRANSFORMS INTO MST INC. AND APPOINTS NEW GENERAL MANAGER FOR USA

As a next step towards our integration with the Micro Systems Technologies Group, our US entity DYCONEX Inc. has been transformed into MST Inc. The Company is registered in Oregon but still head-quartered at the former address in Phoenix Arizona. MST Inc. represents the DYCONEX scope of prod-ucts as well as all other offerings of the MST Group.

In this context, we are pleased to announce the appointment of Kevin Walker as the General Manager of Micro Systems Technology Inc. (MST Inc.). As General Manager, Mr. Walker is responsible for grow-ing the overall MST business and in particular DYCONEX's market share in North America. Mr. Walker contributes senior executive experience from both the high-end PCB as well as the base materials industry. Mr. Walker has a proven track record in international sales and holds a BS in Industrial Engineering from Texas Tech University.

About MST:
The MST Group comprises 5 technology companies located in Germany, the United States, and Swit-zerland. The globally active group provides innovative products and services for medical devices, especially implants, and other high-reliability/high-performance industries. The offering includes amongst others HDI/microvia PCBs, ceramic substrates, electronic module design and manufacturing, batteries and hermetic feedthroughs for implants, as well as catheter technology.