News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at IMAPS Device Packaging 2017 - USA

IMAPS
Device Packaging
March 7 - 8, 2017
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Booth# 14

MST at MEDTEC Europe 2017

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 4 - 6, 2017
Messe Stuttgart, Germany
Swiss Pavilion Booth# 1L28

MST at MEDTEC Japan 2017

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Medical Device Manufacturing & Design Technology
April 19 - 21, 2017
Tokyo Big Sight, Tokyo, Japan
Swiss Pavilion


DYCONEX IMPLEMENTS STATE-OF-THE-ART REGISTRATION PROCEDURE

In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.

As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.

 

As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:

  • Significantly improved layer to layer alignment
  • higher process robustness
  • better product quality and product reliability
  • reduced process times
  • cost reduction
  • increased productivity
  • less mechanical stress on the PCB during production, especially for thin flex products
  • improved material traceability