DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.
DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.
Microelectronics & Packaging
September 10 - 13, 2017
University of Technology, Warsaw, Poland
September 13, 2017
Convention Center, Santa Clara, CA, USA
October 10 - 11, 2017
Raleigh, NC, USA
In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.
As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.
As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:
© 2017 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland