DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA
In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.
As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.
As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland