DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.
March 11 - 12, 2014
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA
Medical Device & Biopharma Design and Manufacturing
March 26 - 27, 2014
Convention & Exhibition Center, Boston, MA, USA
In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.
As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.
As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:
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DYCONEX AG, CH-8303 Bassersdorf, Switzerland