News & Events

christian_beck
24.09.2014

Change in sales management at DYCONEX

DYCONEX is making a new appointment for the position of Director Sales starting October 1, 2014. Following a familiarization phase, Christian Beck will assume the duties of Stefan Hilfiker, who has decided to take an 11-month sabbatical leave.

MST at COMPAMED 2014

COMPAMED

High tech solutions for medical technology
November 12 - 14, 2014
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at Advanced Technology Workshop on Microelectronics 2014, France

IMAPS
Workshop on Microelectronics, Systems & Packaging for Medical Applications
December 9 - 11, 2014
Metropole Congress Hotel, Lyon, France


DYCONEX IMPLEMENTS STATE-OF-THE-ART REGISTRATION PROCEDURE

In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.

As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.

 

As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:

  • Significantly improved layer to layer alignment
  • higher process robustness
  • better product quality and product reliability
  • reduced process times
  • cost reduction
  • increased productivity
  • less mechanical stress on the PCB during production, especially for thin flex products
  • improved material traceability