DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
The focal point of aerospace
June 1-4, 2016
Berlin ExpoCenter Airport
Hall ILA6, Booth# 620
Medical Design & Manufacturing
June 14 - 16, 2016
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 557
Manufacturing Processes for Medical Technology
August 31 - September 2, 2016
Marina Bay Sands, Singapore
September 13 - 15, 2016
Convention Center, Santa Clara, CA, USA
In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.
As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.
As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:
© 2016 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland