News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

MST at Medical Electronics Symposium 2015

SMTA_iNemi

Microelectronics
September 16 - 17, 2015
Marylhurst University, Portland, OR, USA

DYCONEX at PCB West 2015

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PCB Industry
September 15 - 17, 2015
Convention Center, Santa Clara, CA, USA

DYCONEX at 23. FED-Conference



PCB Industry
September 24 - 26, 2015
Hotel Grand La Strada, Kassel, DE

MST at International Symposium on Microelectronics 2015, USA

IMAPS
Microelectronics
October 27 - 28, 2015
Rosen Centre Hotel, Orlando, FL, USA
Booth# 707


DYCONEX IMPLEMENTS STATE-OF-THE-ART REGISTRATION PROCEDURE

In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.

As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.

 

As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:

  • Significantly improved layer to layer alignment
  • higher process robustness
  • better product quality and product reliability
  • reduced process times
  • cost reduction
  • increased productivity
  • less mechanical stress on the PCB during production, especially for thin flex products
  • improved material traceability