News & Events


DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

DYCONEX at electronica 2016


Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
Hall C4, booth# 610

At the PCB & Components Marketplace Forum, Bernhard Schmuki, Field Application Engineer at DYCONEX, will present a recent product development and its impact on new applications under the theme: “More functionality thanks to ultra-thin materials”.

You are welcome to attend his speech on Thursday, November 10 at 4.30 pm, hall B4, booth# 365.



High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at IMAPS Technology Workshop Lyon 2016 - France

Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France


In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.

As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.


As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:

  • Significantly improved layer to layer alignment
  • higher process robustness
  • better product quality and product reliability
  • reduced process times
  • cost reduction
  • increased productivity
  • less mechanical stress on the PCB during production, especially for thin flex products
  • improved material traceability