News & Events

27.01.2015

DYCONEX at EIPC 2015


eipc

EIPC Winter Conference
February 5-6, 2015
Hotel NH Munich Airport, Munich, Germany

Dr. Hans-Peter Klein will give a presentation
about the theme:
Flex PCB Reliability - The proof of evidence
It will take place on Thursday, February 5, 11:25hrs

MST at MD&M West Anaheim 2015

MD&M West

Medical Design & Manufacturing
February 10 - 12, 2015
Convention Center Anaheim, CA, USA
Hall E, Booth# 518

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging
March 17 - 18, 2015
Radisson Fort McDowell Resort, Scottsdale/Fountain Hills, AZ, USA


DYCONEX IMPLEMENTS STATE-OF-THE-ART REGISTRATION PROCEDURE

In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.

As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.

 

As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:

  • Significantly improved layer to layer alignment
  • higher process robustness
  • better product quality and product reliability
  • reduced process times
  • cost reduction
  • increased productivity
  • less mechanical stress on the PCB during production, especially for thin flex products
  • improved material traceability