DYCONEX IMPLEMENTS STATE-OF-THE-ART REGISTRATION PROCEDURE

In order to respond to the ever increasing demands for finer features, higher reliability and shorter lead times for multilayer PCBs, DYCONEX has engineered a state-of-the-art registration workflow.

As PCB designs become more complex, the implications of dimensional instability and registration errors become more severe. A key factor in mastering this challenge is an advanced registration methodology together with dedicated manufacturing equipment. There are two essential prerequisites for the new process: first, laser direct imaging (LDI) exposure technology and second, state-of-the-art X-ray measuring and drilling equipment that generates high-quality fiducials after lamination. On their own, either LDI or
X-ray drilling add value to improve the registration process. However, only the combination of the two together with a comprehensive and dedicated alignment of our production process provides the technological abilities to achieve optimal results. The new registration procedure is compatible with all existing processes.

As a direct result of this improvement in capability, DYCONEX sees significant customer benefits including:

• Significantly improved layer to layer alignment
• higher process robustness
• better product quality and product reliability
• reduced process times
• cost reduction
• increased productivity
• less mechanical stress on the PCB during production, especially for thin flex products
• improved material traceability