News & Events

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31.10.2017

DYCONEX automates production processes with robots

DYCONEX AG increases productivity in production through targeted use of robot handling systems for loading and unloading laser machines.

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at COMPAMED 2017

COMPAMED

High tech solutions for medical technology
November 13 - 16, 2017
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at MD&M West Anaheim 2018

MD&M West

Medical Design & Manufacturing
February 6 - 8, 2018
Convention Center Anaheim, CA, USA
Hall E, Booth# 618


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.