DYCONEX is making a new appointment for the position of Director Sales starting October 1, 2014. Following a familiarization phase, Christian Beck will assume the duties of Stefan Hilfiker, who has decided to take an 11-month sabbatical leave.
Workshop on Microelectronics, Systems & Packaging for Medical Applications
December 9 - 11, 2014
Metropole Congress Hotel, Lyon, France
Medical Design & Manufacturing
February 10 - 12, 2015
Convention Center Anaheim, CA, USA
Hall E, Booth# 518
As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.
With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.
© 2014 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland