DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.
Scandinavian Electronics Event
April 24 - 26, 2018
Kistamässan Science Citx, Kista/Stockholm, Sweden
Hall C, Booth# C11:33
Electronic Materials & Processes for Space (EMPS) Workshop
April 25 - 26, 2018
Y-Parc, Yverdon-les-Bains, Switzerland
Presentation by Bernhard Schmuki:
Ultra-thin rigid PCBs with highly reliable anylayer and HDI build-ups
Trade Show for Aviation, Defense & Security and Space
April 25 - 27, 2018
ExpoCenter Airport, Berlin, Germany
Hall 6 - International Suppliers Center (ISC), Booth# 424
June 5 - 7, 2018
Messezentrum Nuremberg, Germany
Hall 5, Booth# 211-C
As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.
With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.
© 2018 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland