News & Events

my-photo-2581_web
17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

DYCONEX at SMT 2015

SMT

SMT/HYBRID/PACKAGING
May 5 - 7, 2015
Messezentrum Nürnberg, Germany
Hall 6, Booth# 217C

MST at [MEET THE EXPERT] IMPLANTS 2015

meet_the_expert_108px

Development, Manufacturing and Use of passive & active implants
May 7 - 8, 2015
Congress Center Interlaken, Switzerland

DYCONEX at IMS 2015 International Microwave Symposium

ims_2015_108px

Microwave Technology
May 19 - 21, 2015
Phoenix Convention Center, Phoenix, AZ, USA
Booth# 3622

MST at MD&M East New York 2015

mdm_east_108px

Medical Design & Manufacturing
June 9 - 11, 2015
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 2207


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.