News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

MST at RF and Microwave Packaging (RaMP) 2015

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RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK

MST at MEDTEC Europe 2015

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 21 - 23, 2015
Messe Stuttgart, Germany
Hall 3, Booth# E28

MST at MEDTEC Japan 2015

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Medical Device Manufacturing & Design Technology
April 22 - 24, 2015
Tokyo Big Sight, Tokyo, Japan
Swiss Medtech Pavilion

DYCONEX at NER 2015


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7th International IEEE EMBS Neural Engineering Conference
April 22-24, 2015
The Corum, Montpellier, France

A poster presentation will be held about the theme:
Complex, multilayer liquid crystal polymer lead structures qualified for direct biocompatible implants


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.