News & Events

dyconex_ist_labor
01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

en9100_logo
08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at International Symposium on Microelectronics 2017, USA

IMAPS
Microelectronics
October 10 - 11, 2017
Raleigh, NC, USA
Booth# 325

DYCONEX at European Microwave Week 2017

EuMweek_2017

Europe's Premier Microwave, RF, Wireless and Radar Event
October 10 - 12, 2017
Exhibiting Center Nuremberg, Germany
Hall G85, Booth# 307

DYCONEX at Airtec 2017

Airtec

The global aerospace supply chain in one place
October 24 - 26, 2017
AeroExpoPark next to Munich Airport, Germany
Booth# G85


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.