DYCONEX AG, an MST company and the world's leading supplier of highly complex circuit board solutions, has made a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH.
October 27 - 28, 2015
Rosen Centre Hotel, Orlando, FL, USA
High tech solutions for medical technology
November 16 - 19, 2015
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03
Microelectronics, Systems & Packaging
November 25 - 26, 2015
Metropole Hotel, Lyon, France
As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.
With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland