News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at Swiss Medtech Day 2017

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Medical Technology
June 13, 2017
Kursaal, Berne, Switzerland

MST at MD&M East New York 2017

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Medical Design & Manufacturing
June 13 - 15, 2017
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 2163

DYCONEX at Paris Airshow 2017

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52nd International Paris Air Show
June 19-25, 2017
Le Bourget, Paris
HAll 4, Booth# D193


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.