News & Events

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08.09.2015

DYCONEX invests in a new high-precision drilling and routing machine from Schmoll

DYCONEX AG, an MST company and the world's leading supplier of highly complex circuit board solutions, has made a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH.

MST at Symposium on Polymers for Microelectronics 2016

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Polymers for Microelectronics
April 25 - 27, 2016
Winterthur, Wilmington, DE, USA

MST at IMS 2016 International Microwave Symposium

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Microwave Technology
May 24 - 26, 2016
Moscone Center, San Francisco, CA, USA
Booth# 549

DYCONEX at ILA 2016

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The focal point of aerospace
June 1-4, 2016
Berlin ExpoCenter Airport
Hall ILA6, Booth# 620

MST at MD&M East New York 2016

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Medical Design & Manufacturing
June 14 - 16, 2016
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 557


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.