News & Events

christian_beck
24.09.2014

Change in sales management at DYCONEX

DYCONEX is making a new appointment for the position of Director Sales starting October 1, 2014. Following a familiarization phase, Christian Beck will assume the duties of Stefan Hilfiker, who has decided to take an 11-month sabbatical leave.

MST at COMPAMED 2014

COMPAMED

High tech solutions for medical technology
November 12 - 14, 2014
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at Advanced Technology Workshop on Microelectronics 2014, France

IMAPS
Workshop on Microelectronics, Systems & Packaging for Medical Applications
December 9 - 11, 2014
Metropole Congress Hotel, Lyon, France


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.