News & Events

06.06.2014

DYCONEX qualifies new Multibond process for high-reliability PCBs

DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.

MST at Medical Electronics Symposium 2014

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Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA

MST at IMAPS 2014 - USA

IMAPS
Microelectronics
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
Booth# 335

MST at Neurotech Leaders Forum 2014

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Neurotechnology Industry 
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.