DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.
March 6 - 7, 2018
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, AZ, USA
Conference for the German-speaking aviation and space industry
March 22, 2018
Priora Business Center, Zurich, Switzerland
Please note, the event will mainly be held in German.
As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.
With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.
© 2017 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland