In the first half of 2013 DYCONEX AG invested into several pieces of equipment that will further enhance production technology providing optimized PCB solutions for customers.
The purchase of the field-proven Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system - as the third LDI system in production - is another step in pursuing our strategy to convert all exposure jobs to direct imaging.
The Sorin Group Cardiac Rhythm Management Business Unit (Sorin CRM) has honored DYCONEX as the best supplier for printed circuit boards in 2012. The prize was handed over in mid June 2013 as part of the annual supplier event in Clamart, France.
Medical Design & Manufacturing
February 11 - 13, 2014
Convention Center Anaheim, CA, USA
Hall E, Booth# 618
As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.
With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.
© 2013 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland