News & Events

1802_FTS-AGV-591
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

MST at IMAPS Device Packaging 2018 - USA

IMAPS
Device Packaging
March 6 - 7, 2018
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, AZ, USA
Booth# 28

DYCONEX at Bodensee Aerospace Meeting 2018

bam-logo

Conference for the German-speaking aviation and space industry 
March 22, 2018
Priora Business Center, Zurich, Switzerland

Please note, the event will mainly be held in German. 


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.