DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.
May 5 - 7, 2015
Messezentrum Nürnberg, Germany
Hall 6, Booth# 217C
Development, Manufacturing and Use of passive & active implants
May 7 - 8, 2015
Congress Center Interlaken, Switzerland
May 19 - 21, 2015
Phoenix Convention Center, Phoenix, AZ, USA
Medical Design & Manufacturing
June 9 - 11, 2015
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 2207
As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.
With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland