News & Events

1802_FTS-AGV_208
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

DYCONEX at SENSOR+TEST 2018

SENSOR+TEST

Measuring, Testing, Monitoring
June 26 - 28, 2018
Messezentrum Nuremberg, Germany
Hall 1, Booth# 538

DYCONEX at PCB West 2018

pcb_west2018_108px

PCB Industry
September 12, 2018
Convention Center, Santa Clara, CA, USA
Booth# 203

DYCONEX at Electronics System-Integration Technology Conference 2018 (ESTC)

estc_logo

Conference on electronics and systemintegration technology
September 18 - 20, 2018
The Westin Bellevue Hotel, Dresden, Germany

Presentation by Dr. Eckardt Bihler 
Hermetic LCP modules with NFC communication


DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.