News & Events

14.05.2012

DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
14.05.2012

DYCONEX is rated as a No.1 company by Dun & Bradstreet

Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.
05.04.2012

DYCONEX is a founding member of iNEMI’s «Defining Reliability Requirements for Implantable Medical Devices» project

We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»

DYCONEX at SPIE 2012

SPIE
Defense, Security + Sensing
April 24 - 26, 2012
Baltimore Convention Center, Baltimore, MD, USA
Booth# 314

DYCONEX at SMT 2012

SMT

SMT/HYBRID/PACKAGING
May 8 - 10, 2012
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth#428

DYCONEX OFFERS VIA FILL & STACKED VIA PROCESS

As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via filling process for mechanical, laser and plasma drilled blind vias. The process enables us to plate blind vias with an excellent via filling ratio and through holes with good throwing power in one process step.

With its new development, DYCONEX is now able to achieve full flexibility in layer interconnect, including the offering of stacked vias. By applying a build-up comprising stacked vias, PCB designers are able to achieve a significant reduction in formfactor. Furthermore, the planar surfaces achieved with filled vias in solder pads will lead to increased solder joint reliability and the higher copper cross section will benefit the PCB's heat dissipation.