DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.
RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK
Leading European trade show for medical manufacturing industry
April 21 - 23, 2015
Messe Stuttgart, Germany
Hall 3, Booth# E28
Medical Device Manufacturing & Design Technology
April 22 - 24, 2015
Tokyo Big Sight, Tokyo, Japan
Swiss Medtech Pavilion
7th International IEEE EMBS Neural Engineering Conference
April 22-24, 2015
The Corum, Montpellier, France
A poster presentation will be held about the theme:
Complex, multilayer liquid crystal polymer lead structures qualified for direct biocompatible implants
Substrates for high frequency SiP and MCM packages are not only subject to form factor requirements; they must also provide superior RF properties in combination with good heat diffusion and controllable thermal expansion. By combining the latest multilayer LCP fine-line substrate technology with a targeted use of laser cavities and metallic heat-sinks, DYCONEX has achieved an optimized interconnect design that accomplishes all of these desired performance characteristics.
Liquid Crystal Polymer (LCP) substrates demonstrate superior performance across a wide range of the RF spectrum, and remain stable even under harsh environmental conditions such as extreme temperature and humidity. To make best use of LCP's material and electrical properties, it is advantageous to have the signal traces guided through an inner layer with shielding above and below. Laser-generated cavities then allow for direct access to these inner layers, and thus circumvent the need for microvia interconnect. This combination ensures ideal signal integrity from the die to the next packaging level.
Since high frequency semiconductors are often high power devices as well, the heat generated by these devices during operation has to be dissipated effectively. To achieve this purpose, DYCONEX has combined LCP substrates with various forms of metallic carriers. An opening in the substrate allows a direct attachment of the die on to the carrier. Subsequently, small wire wedge-wedge bonding is utilized to interconnect.
The thermal expansion factor of the entire package is primarily controlled by the metallic carrier due to its higher stiffness. This reduces the thermal mismatch of the die to the substrate and consequently improves the RF packages reliability.
© 2015 Micro Systems Technologies, CH-6340 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland