News & Events

1802_FTS-AGV-591
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

DYCONEX at S.E.E. 2018

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Scandinavian Electronics Event
April 24 - 26, 2018
Kistamässan Science Citx, Kista/Stockholm, Sweden
Hall C, Booth# C11:33

DYCONEX at EMPS workshop

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Electronic Materials & Processes for Space (EMPS) Workshop

April 25 - 26, 2018
Y-Parc, Yverdon-les-Bains, Switzerland

Presentation by Bernhard Schmuki: 

Ultra-thin rigid PCBs with highly reliable anylayer and HDI build-ups

DYCONEX at ILA 2018

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Trade Show for Aviation, Defense & Security and Space
April 25 - 27, 2018
ExpoCenter Airport, Berlin, Germany
Hall 6 - International Suppliers Center (ISC), Booth# 424 

Details on DYCONEX presence

DYCONEX at SMT 2018

SMT HYBRID PACKAGING 2017

SMT/HYBRID/PACKAGING
June 5 - 7, 2018
Messezentrum Nuremberg, Germany
Hall 5, Booth# 211-C


DYCONEX DEVELOPS NEW MULTILAYER CAVITY LCP PACKAGE SUBSTRATE TECHNOLOGY FOR HIGH FREQUENCY APPLICATIONS

Substrates for high frequency SiP and MCM packages are not only subject to form factor requirements; they must also provide superior RF properties in combination with good heat diffusion and controllable thermal expansion. By combining the latest multilayer LCP fine-line substrate technology with a targeted use of laser cavities and metallic heat-sinks, DYCONEX has achieved an optimized interconnect design that accomplishes all of these desired performance characteristics.

Liquid Crystal Polymer (LCP) substrates demonstrate superior performance across a wide range of the RF spectrum, and remain stable even under harsh environmental conditions such as extreme temperature and humidity. To make best use of LCP's material and electrical properties, it is advantageous to have the signal traces guided through an inner layer with shielding above and below. Laser-generated cavities then allow for direct access to these inner layers, and thus circumvent the need for microvia interconnect. This combination ensures ideal signal integrity from the die to the next packaging level.

Since high frequency semiconductors are often high power devices as well, the heat generated by these devices during operation has to be dissipated effectively. To achieve this purpose, DYCONEX has combined LCP substrates with various forms of metallic carriers. An opening in the substrate allows a direct attachment of the die on to the carrier. Subsequently, small wire wedge-wedge bonding is utilized to interconnect.

The thermal expansion factor of the entire package is primarily controlled by the metallic carrier due to its higher stiffness. This reduces the thermal mismatch of the die to the substrate and consequently improves the RF packages reliability.