News & Events

dyconex_logo_25years
12.05.2016

DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

MST at Medical Manufacturing Asia 2016

medical_manufacturing_asia_108px

Manufacturing Processes for Medical Technology
August 31 - September 2, 2016
Marina Bay Sands, Singapore
Booth# 2L07A

MST at Medical Electronics Symposium 2016

medical_electronics_conference_200_px

Microelectronics
September 14 - 15, 2016
Marylhurst University, Portland, OR, USA

DYCONEX at PCB West 2016

pcb_west_108px

PCB Industry
September 13 - 15, 2016
Convention Center, Santa Clara, CA, USA
Booth# 518 


DYCONEX DEVELOPS NEW MULTILAYER CAVITY LCP PACKAGE SUBSTRATE TECHNOLOGY FOR HIGH FREQUENCY APPLICATIONS

Substrates for high frequency SiP and MCM packages are not only subject to form factor requirements; they must also provide superior RF properties in combination with good heat diffusion and controllable thermal expansion. By combining the latest multilayer LCP fine-line substrate technology with a targeted use of laser cavities and metallic heat-sinks, DYCONEX has achieved an optimized interconnect design that accomplishes all of these desired performance characteristics.

Liquid Crystal Polymer (LCP) substrates demonstrate superior performance across a wide range of the RF spectrum, and remain stable even under harsh environmental conditions such as extreme temperature and humidity. To make best use of LCP's material and electrical properties, it is advantageous to have the signal traces guided through an inner layer with shielding above and below. Laser-generated cavities then allow for direct access to these inner layers, and thus circumvent the need for microvia interconnect. This combination ensures ideal signal integrity from the die to the next packaging level.

Since high frequency semiconductors are often high power devices as well, the heat generated by these devices during operation has to be dissipated effectively. To achieve this purpose, DYCONEX has combined LCP substrates with various forms of metallic carriers. An opening in the substrate allows a direct attachment of the die on to the carrier. Subsequently, small wire wedge-wedge bonding is utilized to interconnect.

The thermal expansion factor of the entire package is primarily controlled by the metallic carrier due to its higher stiffness. This reduces the thermal mismatch of the die to the substrate and consequently improves the RF packages reliability.