In the first half of 2013 DYCONEX AG invested into several pieces of equipment that will further enhance production technology providing optimized PCB solutions for customers.
The purchase of the field-proven Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system - as the third LDI system in production - is another step in pursuing our strategy to convert all exposure jobs to direct imaging.
The Sorin Group Cardiac Rhythm Management Business Unit (Sorin CRM) has honored DYCONEX as the best supplier for printed circuit boards in 2012. The prize was handed over in mid June 2013 as part of the annual supplier event in Clamart, France.
Medical Design & Manufacturing
February 11 - 13, 2014
Convention Center Anaheim, CA, USA
Hall E, Booth# 618
Substrates for high frequency SiP and MCM packages are not only subject to form factor requirements; they must also provide superior RF properties in combination with good heat diffusion and controllable thermal expansion. By combining the latest multilayer LCP fine-line substrate technology with a targeted use of laser cavities and metallic heat-sinks, DYCONEX has achieved an optimized interconnect design that accomplishes all of these desired performance characteristics.
Liquid Crystal Polymer (LCP) substrates demonstrate superior performance across a wide range of the RF spectrum, and remain stable even under harsh environmental conditions such as extreme temperature and humidity. To make best use of LCP's material and electrical properties, it is advantageous to have the signal traces guided through an inner layer with shielding above and below. Laser-generated cavities then allow for direct access to these inner layers, and thus circumvent the need for microvia interconnect. This combination ensures ideal signal integrity from the die to the next packaging level.
Since high frequency semiconductors are often high power devices as well, the heat generated by these devices during operation has to be dissipated effectively. To achieve this purpose, DYCONEX has combined LCP substrates with various forms of metallic carriers. An opening in the substrate allows a direct attachment of the die on to the carrier. Subsequently, small wire wedge-wedge bonding is utilized to interconnect.
The thermal expansion factor of the entire package is primarily controlled by the metallic carrier due to its higher stiffness. This reduces the thermal mismatch of the die to the substrate and consequently improves the RF packages reliability.
© 2013 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland