DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.
We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»

Defense, Security + Sensing
April 24 - 26, 2012
Baltimore Convention Center, Baltimore, MD, USA
Booth# 314

SMT/HYBRID/PACKAGING
May 8 - 10, 2012
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth#428
DYCONEX has extended its capabilities in dimensional measurement and analysis for 2D and 3D objects with the acquisition of a new ProX3 coordinate measurement system from Impex.
Making best use of its high speed scanning system, the ProX3 will be primarily used for in-process control in the mechanical drilling and routing departments. Within minutes, the ProX3 can measure all mechanically drilled holes and selected contours of a PCB production panel with an accuracy of ± 5 µm for panel sizes up to 18"x 24". Furthermore, the new 3D metrology system can be effectively used to monitor and analyse various process indicators during the PCB manufacturing process, and hence supports our continuous efforts to improve product quality.
© 2011 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Basserdorf, Switzerland