News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging

Exhibition and technology showcase
March 17 - 18, 2015
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and technical workshops
March 17 - 19, 2015
A presentation will be held at the symposium on 11:15 AM - 11:45 AM about:
Advanced electronic packaging options for miniaturization on complex medical devices

MST at RF and Microwave Packaging (RaMP) 2015

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RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK


DYCONEX INTRODUCES NEW MEASUREMENT EQUIPMENT

DYCONEX has extended its capabilities in dimensional measurement and analysis for 2D and 3D objects with the acquisition of a new ProX3 coordinate measurement system from Impex.

Making best use of its high speed scanning system, the ProX3 will be primarily used for in-process control in the mechanical drilling and routing departments. Within minutes, the ProX3 can measure all mechanically drilled holes and selected contours of a PCB production panel with an accuracy of ± 5 µm for panel sizes up to 18"x 24". Furthermore, the new 3D metrology system can be effectively used to monitor and analyse various process indicators during the PCB manufacturing process, and hence supports our continuous efforts to improve product quality.