DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.
Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA
Taking mechanical drilling capabilities one step further, DYCONEX has implemented new, state-of-the art drilling systems capable of routinely producing mechanical holes with diameters as low as 100 micrometers, and even as low as 75 micrometers for some specialty applications! Previously only in the realm of laser hole generation processes, this newly developed mechanical drill capability is already directly reducing product lead times, increasing process efficiency and improving product yields due to generally better hole quality and tighter positioning accuracy.
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DYCONEX AG, CH-8303 Bassersdorf, Switzerland