DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.
We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»

Defense, Security + Sensing
April 24 - 26, 2012
Baltimore Convention Center, Baltimore, MD, USA
Booth# 314

SMT/HYBRID/PACKAGING
May 8 - 10, 2012
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth#428
Taking mechanical drilling capabilities one step further, DYCONEX has implemented new, state-of-the art drilling systems capable of routinely producing mechanical holes with diameters as low as 100 micrometers, and even as low as 75 micrometers for some specialty applications! Previously only in the realm of laser hole generation processes, this newly developed mechanical drill capability is already directly reducing product lead times, increasing process efficiency and improving product yields due to generally better hole quality and tighter positioning accuracy.
© 2011 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Basserdorf, Switzerland