News & Events

14.05.2012

DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!

14.05.2012

DYCONEX is rated as a No.1 company by Dun & Bradstreet

Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.

05.04.2012

DYCONEX is a founding member of iNEMI’s «Defining Reliability Requirements for Implantable Medical Devices» project

We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»

DYCONEX at SPIE 2012

SPIE
Defense, Security + Sensing
April 24 - 26, 2012
Baltimore Convention Center, Baltimore, MD, USA
Booth# 314

DYCONEX at SMT 2012

SMT

SMT/HYBRID/PACKAGING
May 8 - 10, 2012
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth#428


DYCONEX IMPLEMENTS EFFICIENT SOFTWARE FOR PCB DESIGN COMPENSATION

As PCB design complexity and density continue to increase, front-end data preparation efforts must be evermore exact and provide production artwork that is tailored to meet specific customer requirements. A challenging example is provided by the case where the customer has defined specific line width targets and provided tolerance ranges that, as a percentage of nominal target line width, must be met everywhere on the circuit. Due to the dependency of etch rate upon design spacing, it follows that some circuit elements may need to be individually compensated according to the localized spacing conditions inherent to the design. With especially complex designs this mostly manual effort can be very tedious and time consuming, often overreaching the available time or human resources allocated to complete the task.

With the objective of becoming faster, more accurate, and more cost-effective in the data prep tasks as described, DYCONEX has implemented a new software application named TEC (True Etch Compensation) that will largely automate this process. Additional benefits may likewise be seen long-term in the form of higher process stability and higher production yields.