News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

MST at RF and Microwave Packaging (RaMP) 2015

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RF and Microwave Packaging (RaMP)
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK

MST at MEDTEC Europe 2015

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 21 - 23, 2015
Messe Stuttgart, Germany
Hall 3, Booth# E28

MST at MEDTEC Japan 2015

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Medical Device Manufacturing & Design Technology
April 22 - 24, 2015
Tokyo Big Sight, Tokyo, Japan
Swiss Medtech Pavilion

DYCONEX at NER 2015


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7th International IEEE EMBS Neural Engineering Conference
April 22-24, 2015
The Corum, Montpellier, France

A poster presentation will be held about the theme:
Complex, multilayer liquid crystal polymer lead structures qualified for direct biocompatible implants


DYCONEX IMPLEMENTS EFFICIENT SOFTWARE FOR PCB DESIGN COMPENSATION

As PCB design complexity and density continue to increase, front-end data preparation efforts must be evermore exact and provide production artwork that is tailored to meet specific customer requirements. A challenging example is provided by the case where the customer has defined specific line width targets and provided tolerance ranges that, as a percentage of nominal target line width, must be met everywhere on the circuit. Due to the dependency of etch rate upon design spacing, it follows that some circuit elements may need to be individually compensated according to the localized spacing conditions inherent to the design. With especially complex designs this mostly manual effort can be very tedious and time consuming, often overreaching the available time or human resources allocated to complete the task.

With the objective of becoming faster, more accurate, and more cost-effective in the data prep tasks as described, DYCONEX has implemented a new software application named TEC (True Etch Compensation) that will largely automate this process. Additional benefits may likewise be seen long-term in the form of higher process stability and higher production yields.