News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at EMPC - European Microelectronics & Packaging Conference 2017

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Microelectronics & Packaging
September 10 - 13, 2017
University of Technology, Warsaw, Poland
Booth# tbd

DYCONEX at PCB West 2017

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PCB Industry
September 13, 2017
Convention Center, Santa Clara, CA, USA
Booth# 200

MST at International Symposium on Microelectronics 2017, USA

IMAPS
Microelectronics
October 10 - 11, 2017
Raleigh, NC, USA
Booth# 325


DYCONEX INSTALLED NEW PLASMA DESMEARING EQUIPMENT

Following through with another investment milestone planned for this year, DYCONEX successfully installed new plasma desmearing equipment this month, replacing an existing unit which has admirably served it's task for many years. The new equipment greatly extends the envelope of capability and enhances applicability of the plasma desmearing process.

Plasma desmearing processes are typically applied after laser/mechanical hole generation or contour routing steps. Plasma desmearing serves to clean the PCB surface of laser burn residues and polymer smear that otherwise would hinder surface activation prior to electrochemical copper plating. Although chemically less aggressive than older units, the new plasma desmear will nevertheless provide improved plating quality by reducing nodule formation and virtually eliminating the occurrence of plating voids.

Last but not least, lot tracking and process control will improved. New speciality plasma treatments for improved bondability will be possible for products where resist stripping has hitherto been difficult.