News & Events

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01.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at MEDTEC Europe 2017

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 4 - 6, 2017
Messe Stuttgart, Germany
Swiss Pavilion Booth# 1L28

MST at MEDTEC Japan 2017

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Medical Device Manufacturing & Design Technology
April 19 - 21, 2017
Tokyo Big Sight, Tokyo, Japan
Swiss Pavilion

DYCONEX at SMT 2017

SMT HYBRID PACKAGING 2017

SMT/HYBRID/PACKAGING
May 16 - 18, 2017
Messezentrum Nuremberg, Germany
DYCONEX: Hall 5, Booth# 5-321


DYCONEX INSTALLED NEW PLASMA DESMEARING EQUIPMENT

Following through with another investment milestone planned for this year, DYCONEX successfully installed new plasma desmearing equipment this month, replacing an existing unit which has admirably served it's task for many years. The new equipment greatly extends the envelope of capability and enhances applicability of the plasma desmearing process.

Plasma desmearing processes are typically applied after laser/mechanical hole generation or contour routing steps. Plasma desmearing serves to clean the PCB surface of laser burn residues and polymer smear that otherwise would hinder surface activation prior to electrochemical copper plating. Although chemically less aggressive than older units, the new plasma desmear will nevertheless provide improved plating quality by reducing nodule formation and virtually eliminating the occurrence of plating voids.

Last but not least, lot tracking and process control will improved. New speciality plasma treatments for improved bondability will be possible for products where resist stripping has hitherto been difficult.