News & Events

06.06.2014

DYCONEX qualifies new Multibond process for high-reliability PCBs

DYCONEX has installed a new pre-treatment tunnel machine so it can provide an in-house Multibond process. Today, that process is qualified for flex PCBs and inner layers of rigid products.

MST at Medical Electronics Symposium 2014

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Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA

MST at IMAPS 2014 - USA

IMAPS
Microelectronics
October 14 - 15, 2014
Town & Country Resort, San Diego, CA, USA
Booth# 335

MST at Neurotech Leaders Forum 2014

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Neurotechnology Industry 
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA


DYCONEX INSTALLED NEW PLASMA DESMEARING EQUIPMENT

Following through with another investment milestone planned for this year, DYCONEX successfully installed new plasma desmearing equipment this month, replacing an existing unit which has admirably served it's task for many years. The new equipment greatly extends the envelope of capability and enhances applicability of the plasma desmearing process.

Plasma desmearing processes are typically applied after laser/mechanical hole generation or contour routing steps. Plasma desmearing serves to clean the PCB surface of laser burn residues and polymer smear that otherwise would hinder surface activation prior to electrochemical copper plating. Although chemically less aggressive than older units, the new plasma desmear will nevertheless provide improved plating quality by reducing nodule formation and virtually eliminating the occurrence of plating voids.

Last but not least, lot tracking and process control will improved. New speciality plasma treatments for improved bondability will be possible for products where resist stripping has hitherto been difficult.