News & Events


DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

DYCONEX at electronica 2016


Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
Hall C4, booth# 610

At the PCB & Components Marketplace Forum, Bernhard Schmuki, Field Application Engineer at DYCONEX, will present a recent product development and its impact on new applications under the theme: “More functionality thanks to ultra-thin materials”.

You are welcome to attend his speech on Thursday, November 10 at 4.30 pm, hall B4, booth# 365.



High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at IMAPS Technology Workshop Lyon 2016 - France

Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France


Following through with another investment milestone planned for this year, DYCONEX successfully installed new plasma desmearing equipment this month, replacing an existing unit which has admirably served it's task for many years. The new equipment greatly extends the envelope of capability and enhances applicability of the plasma desmearing process.

Plasma desmearing processes are typically applied after laser/mechanical hole generation or contour routing steps. Plasma desmearing serves to clean the PCB surface of laser burn residues and polymer smear that otherwise would hinder surface activation prior to electrochemical copper plating. Although chemically less aggressive than older units, the new plasma desmear will nevertheless provide improved plating quality by reducing nodule formation and virtually eliminating the occurrence of plating voids.

Last but not least, lot tracking and process control will improved. New speciality plasma treatments for improved bondability will be possible for products where resist stripping has hitherto been difficult.