News & Events

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17.02.2015

DYCONEX expands its center of competence for product reliability

DYCONEX AG, an MST company and a world leading supplier of highly complex PCB solutions, opened up new reliability testing laboratories in December 2014 and in doing so further expanded this center of competence.
The new labs unify all the processes needed for the precise monitoring of product reliability.

MST at MEDTEC Europe 2015

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 21 - 23, 2015
Messe Stuttgart, Germany
Hall 3, Booth# E28

MST at MEDTEC Japan 2015

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Medical Device Manufacturing & Design Technology
April 22 - 24, 2015
Tokyo Big Sight, Tokyo, Japan
Swiss Medtech Pavilion

DYCONEX at NER 2015


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7th International IEEE EMBS Neural Engineering Conference
April 22-24, 2015
The Corum, Montpellier, France

A poster presentation will be held about the theme:
Complex, multilayer liquid crystal polymer lead structures qualified for direct biocompatible implants

DYCONEX at SMT 2015

SMT

SMT/HYBRID/PACKAGING
May 5 - 7, 2015
Messezentrum Nürnberg, Germany
Hall 6, Booth# 217C


DYCONEX INSTALLED NEW PLASMA DESMEARING EQUIPMENT

Following through with another investment milestone planned for this year, DYCONEX successfully installed new plasma desmearing equipment this month, replacing an existing unit which has admirably served it's task for many years. The new equipment greatly extends the envelope of capability and enhances applicability of the plasma desmearing process.

Plasma desmearing processes are typically applied after laser/mechanical hole generation or contour routing steps. Plasma desmearing serves to clean the PCB surface of laser burn residues and polymer smear that otherwise would hinder surface activation prior to electrochemical copper plating. Although chemically less aggressive than older units, the new plasma desmear will nevertheless provide improved plating quality by reducing nodule formation and virtually eliminating the occurrence of plating voids.

Last but not least, lot tracking and process control will improved. New speciality plasma treatments for improved bondability will be possible for products where resist stripping has hitherto been difficult.