News & Events

11.02.2014

DYCONEX adds Ticer TCR-HF foils to its range of circuit board technologies

DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defense applications.  

MST at [MEET THE EXPERT] IMPLANTS 2014

meet_the_expert_108px

Development, Manufacturing and Use of passive & active implants
April 28 - 29, 2014
Congress Centre Kursaal, Interlaken, Switzerland

DYCONEX at SMT 2014

SMT

SMT/HYBRID/PACKAGING
May 6- 8, 2014
Messezentrum Nürnberg, Germany
DYCONEX: Hall 9, Booth# 428


DYCONEX INSTALLED NEW PLASMA DESMEARING EQUIPMENT

Following through with another investment milestone planned for this year, DYCONEX successfully installed new plasma desmearing equipment this month, replacing an existing unit which has admirably served it's task for many years. The new equipment greatly extends the envelope of capability and enhances applicability of the plasma desmearing process.

Plasma desmearing processes are typically applied after laser/mechanical hole generation or contour routing steps. Plasma desmearing serves to clean the PCB surface of laser burn residues and polymer smear that otherwise would hinder surface activation prior to electrochemical copper plating. Although chemically less aggressive than older units, the new plasma desmear will nevertheless provide improved plating quality by reducing nodule formation and virtually eliminating the occurrence of plating voids.

Last but not least, lot tracking and process control will improved. New speciality plasma treatments for improved bondability will be possible for products where resist stripping has hitherto been difficult.