News & Events

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31.10.2017

DYCONEX automates production processes with robots

DYCONEX AG increases productivity in production through targeted use of robot handling systems for loading and unloading laser machines.

DYCONEX at Kooperationsforum Leiterplatten

Logo Bayern Innovativ

Forum and Show for Circuit Boards in Smart Systems 
January 30, 2018
Nuremberg, Germany

Speech by Dr. Marc Hauer, Manager R&D DYCONEX:
'Embedding in hermetischen Substraten' (in German)

DYCONEX at EIPC Winter Conference

eipc

Network of Professionals of the Electronics Industry
February 1 - 2, 2018
Lyon, France

Speech by Dr. Marc Hauer, Manager R&D DYCONEX:
'Miniaturized Hermetic Modules for Sensor Integration'

MST at MD&M West Anaheim 2018

MD&M West

Medical Design & Manufacturing
February 6 - 8, 2018
Convention Center Anaheim, CA, USA
Hall E, Booth# 618

MST at IMAPS Device Packaging 2018 - USA

IMAPS
Device Packaging
March 6 - 7, 2018
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, AZ, USA


DYCONEX automates production processes with robots

DYCONEX AG, an MST company and a leading supplier of ultra-complex printed circuit board solutions, increases productivity in production through targeted use of robot handling systems for loading and unloading laser machines.

Deployment of robot handling systems is one of various activities through which DYCONEX automates its in-house production processes. By the end of the year, three specialized robots will relieve laser machine operators of repetitive tasks. The handling systems enable continuous production by operating both during shift hours and overnight without personnel present. “Increased output and greater flexibility in production processes clearly show us that this form of automation is a step in the right direction,” underlines Stephan Messerli, VP Operations at DYCONEX.

DYCONEX has chosen a custom solution for its robots. Since the laser machines are used for both via drilling and routing, it was necessary to design additional elements that were developed in-house due to the complexity of the processes. “Considering our very specialized requirements, we commissioned external partners to work alongside our own engineering team and jointly implement the project from conception to operation,” explains Adrian Balz, Manager Process Module Via Generation & Plating at DYCONEX.

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About DYCONEX AG
With more than 50 years of experience, DYCONEX AG is an international leader in the supply of highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions. These products are used in every application where miniaturization, increased functionality, quality and the highest level of reliability play a role.
With its headquarters in Bassersdorf, DYCONEX today has 180 employees and the company is a member of the Micro Systems Technologies Group.

About the Micro Systems Technologies group
The Micro Systems Technologies Group consists of four high-tech companies that offer innovative components and services for medical devices, in particular implants. Other high-tech industries that demand exceptional performance, quality and the highest levels of reliability also rely on the expertise of MST companies.
The globally active companies that make up the MST Group – DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) – offer their customers integrated solutions ranging from initial design through to series production.

Contact
DYCONEX AG
Grindelstrasse 40
CH-8303 Bassersdorf
Switzerland

Phone +41 (43) 266 1100
Fax     +41 (43) 266 1101
mail.dyconex@mst.com

www.mst.com/dyconex