TECHNOLOGY ROADMAP

Our technology roadmap looks ahead to allow us to meet the future demands of current and targeted customers and fully satisfy their requirements from 2010 to through 2012. The roadmap is based on the regular production of optimized build-ups, but many technologies are available at DYCONEX a full year earlier for prototypes and R&D purposes.

 

FLEX 2010 2011 2012
Conductor line/space (μm) 35/45
 30/40
 25/35
Microvia pad diameter (μm 50/140   50/120  
40/100
Artwork tolerances (μm) +/- 7  
+/- 7  
+/-6
Via/layer and layer/layer tolerances (μm)
 +/- 35 +/- 30 +/- 25
Min. dielectric thickness (μm)
 25 25 12
Number of contuctor layers 10 10+ 10+

RIGID-FLEX 2010 2011 2012
Conductor line/space (μm) 45/50 40/45 35/40
Microvia pad diameter (μm) 125/180 100/150 75/120
Artwork tolerances (μm) +/- 10 +/- 8 +/- 8
Via/layer and layer/layer tolerances (μm) +/- 35 +/- 30 +/- 25
Min. dielectric thickness (μm 25 25 12
Number of contuctor layers 18 20 20+

RIGID 2010 2011 2012
Conductor line/space (μm) 45/50 40/45 35/40
Microvia pad diameter (μm) 125/180 100/150 75/120
Artwork tolerances (μm) +/- 10 +/- 8 +/- 8
Via/layer and layer/layer tolerances (μm) +/- 35
 +/- 30
 +/- 25
Min. dielectric thickness (μm) 60 40
 40
Number of contuctor layers 18 20 20+