Our technology roadmap looks ahead to allow us to meet the future demands of current and targeted customers and fully satisfy their requirements from 2013 to through 2016. The roadmap is based on the regular production of optimized build-ups, but many technologies are available at DYCONEX a full year earlier for prototypes and R&D purposes.
|Microvias/pads diameter, laser flex||50/200||50/150||40/130||35/110|
|Microvias/pads diameter, laser rigid||75/200||60/200||50/150||40/130|
|Artwork to soldermask tolerance||+/-25||+/-25||+/-15||+/-15|
© 2013 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland