TECHNOLOGY ROADMAP

Our technology roadmap looks ahead to allow us to meet the future demands of current and targeted customers and fully satisfy their requirements from 2011 to through 2013. The roadmap is based on the regular production of optimized build-ups, but many technologies are available at DYCONEX a full year earlier for prototypes and R&D purposes.

FLEX 2011 2012 2013
Conductor line/space (μm) 30/40
 25/35
 20/35
Microvia pad diameter (μm 75/200
50/200  
40/100
Artwork to soldermask tolerances (μm) +/- 50 
+/- 25
+/- 15
Via/layer and layer/layer tolerances (μm)
 +/- 30 +/- 25
 +/- 20
Min. dielectric thickness (μm)
 25/8 12/8 12/5
Number of conductor layers 10+ 10+ 10+

RIGID-FLEX 2011 2012 2013
Conductor line/space (μm) 40/45 35/40 30/35
Microvia pad diameter (μm) 100/150 75/150 75/120
Artwork to soldermask tolerances (μm) +/- 50
 +/- 25
 +/- 15
Via/layer and layer/layer tolerances (μm) +/- 30 +/- 25
 +/- 20
Min. dielectric thickness (μm) 25 12 12
Number of conductor layers 20 20+ 24

RIGID 2011 2012 2013
Conductor line/space (μm) 40/45 35/40 25/35
Microvia pad diameter (μm) 100/150 75/120 50/150
Artwork to soldermask tolerances (μm) +/- 50
 +/- 25
 +/- 15
Via/layer and layer/layer tolerances (μm) +/- 30
 +/- 25
 +/- 20
Min. dielectric thickness (μm) 40 40
 40
Number of conductor layers 20 20+ 24