| Scientific Paper | Publication | Issue |
|---|---|---|
| New Features For High-Frequency LCP Package Substrate |
ON BOARD |
May 2010 |
| Wired to succeed |
European Supply Chain Management |
December 2009 |
| Modularised And Standardised PCB Manufacturing | ON BOARD | September 2008 |
| Embedded Resistors On Ceramic Substrate In Flex PCBs |
On BOARD |
February 2007 |
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DYCONEX AG, CH-8303 Basserdorf, Switzerland