As a further step towards miniaturization of printed circuit boards, DYCONEX has implemented a via-filling process for mechanical, laser-drilled blind vias. The process enables us to achieve two things in a single process step: we can plate blind vias with an excellent filling ratio, and at the same time the process exhibits good throwing power to better plate through holes.
With this new development, in combination with its offering of stacked vias, DYCONEX can now provide full flexibility in layer interconnect. By applying a build-up that consists of stacked vias, PCB designers can achieve significant size reductions as well as attain a planar surface that is especially well suited for direct chip attachment and/or BGA soldering processes.
Furthermore, filled vias give designers exacting control of how operating heat is routed to the PCB's surface for its efficient dissipation.
© 2011 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Basserdorf, Switzerland