ULTRA FINE LINE TECHNOLOGY

Printed circuit boards for high-tech electronics are driven mainly by increased functionality and reductions in the form factor. This trend is especially crucial for high-end medical applications such as hearing aids, active implantable devices or medical-imaging equipment. Via/pad geometries down to 50/150 microns with 45/45 micron lines/spaces are state of the art today - but progressive chip integration, smaller component footprints and the need for higher resolution in imaging are driving requirements even further. Today, leading-edge applications depend on ultra-HDI properties that involve 30/30-micron lines/spaces with via/pad diameters of 30/100 µm.

The quest for ever finer conductor structures is a key focus at DYCONEX. Our engineers and R&D department therefore progressively push the fine-line boundary to its limits to ensure that our customers benefit from the latest progress in technology and thus stay at the forefront of ultra-HDI technology.

DYCONEX status:

• in production: lines/spaces = 40/45 µm; vias/pads = 50/150 µm
• in R&D: lines/spaces = 20/30 µm; vias/pads = 25/150 µm
• dielectric/Cu thickness = 25/5 µm
• state-of-the-art equipment and further investment into ultra fine line capability