RIGID

Backed by more than 40 years of experience in building PCBs, with our state-of-the-art equipment and extensive engineering know-how, DYCONEX specializes in the most complex rigid interconnect solutions. The company has earned a reputation as a supplier of high-quality and high-reliability PCBs, especially to the medical, defense and aerospace markets. Rigid capabilities include ultra-high density multilayer boards, high-temperature and thermal-management PCBs as well as RF, ruggedized and metal-core solutions using a variety of dielectric substrates.

Technology Highlights

  • High reliability in numerous applications from implantable medical devices to military and space applications
  • DYCOstrate® build-up with buried and blind vias
  • Thermal-management solutions including metal-based heat sinks using CIC (copper-invar-copper), CMC (copper-molybdenum-copper), CCC (copper carbon copper) as well as aluminum
  • High-frequency rigid multilayer circuit boards in combination with LCP (liquid crystal polymer) as well as other glass-reinforced materials
  • Vibration-resistant metal-core boards
  • Tight line-width tolerances for signal integrity

General capabilities for polyimide rigid circuit boards:

Description Standard Capabilites
Lines/spaces (25 µm copper)
 50/60 µm
Microvia/pad diameter 75/250 µm
Material thickness dielectric/copper min. 50/8 µm
Conductor width tolerance +/- 20%
Layer count
 up to 20

Description Leading-Edge Capabilities
Lines/spaces (25 µm copper) 35/45 µm
Microvia/pad diameter  
60/150 µm
Material thickness dielectric/copper            
50/5 µm
Conductor width tolerance 20%
Layer count
 up to 24