FLEX PRINTED CIRCUITS

Many complex interconnect challenges are best addressed with flexible printed circuit technology. In the pursuit of continuous miniaturization, the outstanding properties of flex base materials enable smaller application form factors with the benefit of reduced weight and optimized volume utilization. In addition to facilitating designs with ultra-dense and precise conductor geometries, we have found that polyimide or LCP (liquid crystal polymer)-based flex materials provide excellent electrical and RF performance characteristics. All these attributes are indispensable to an electronics industry that is driven by the ever-challenging quest to extend functionality on continuously smaller footprints.

With inventions such as our DYCOstrate technology or groundbreaking innovations in microvia formation, DYCONEX is a pioneer in flexible multilayer HDI (high-density interconnect) and ultra-HDI boards. We are empowered by an unquestionable commitment to serve this business segment. As a technology frontrunner, DYCONEX is equipped to cope with cutting-edge design requirements and the most demanding quality standards as applied in the medical and defense industries.

Our high-yield manufacturing of HDI⁽¹ and ultra-HDI⁽² flex applications and professional, hands-on consulting services are compelling reasons to make DYCONEX your flexible printed circuit partner of choice.

^{(1 HDI flex - lines/spaces 50-150 µm, vias 75-130 µm
(2 Ultra-HDI flex - lines/spaces <50 µm, vias 25-75 µm}

Technology Highlights

• Turnkey flex solutions targeting 3D miniaturization
• Highly reliable, extremely robust multilayer flex/microvia substrates
• Filled via and stacked via process available
• Wraparound boards
• Chip-on-flex (COF) and chip scale packaging (CSP) substrates
• A wide variety of surface finishes, for example OSP, ENIG, ENEPIG, E-AU
• Flying leads
• Bending test for flexible circuits
• Ultra High Density flex cables
• Complex mechanical and assembly assist features:
  
  • thinned bending zones in flexible regions
  • special profiles
  • fold lines
  • cutouts
  • cavities in flex or grooves

General capabilities for flex circuit boards: