FLEX PRINTED CIRCUITS

Many complex interconnect challenges are best addressed with flexible printed circuit technology. In the pursuit of continuous miniaturization, the outstanding properties of flex base materials enable smaller application form factors with the benefit of reduced weight and optimized volume utilization. In addition to facilitating designs with ultra-dense and precise conductor geometries, we have found that polyimide or LCP (liquid crystal polymer)-based flex materials provide excellent electrical and RF performance characteristics. All these attributes are indispensable to an electronics industry that is driven by the ever-challenging quest to extend functionality on continuously smaller footprints.

With inventions such as our DYCOstrate technology or groundbreaking innovations in microvia formation, DYCONEX is a pioneer in flexible multilayer HDI (high-density interconnect) and ultra-HDI boards. We are empowered by an unquestionable commitment to serve this business segment. As a technology frontrunner, DYCONEX is equipped to cope with cutting-edge design requirements and the most demanding quality standards as applied in the medical and defense industries.

Our high-yield manufacturing of HDI and ultra-HDI flex applications and professional, hands-on consulting services are compelling reasons to make DYCONEX your flexible printed circuit partner of choice.

1 HDI flex - lines/spaces 50-150 µm, vias 75-130 µm
2 Ultra-HDI flex - lines/spaces <50 µm, vias 25-75 µm

Technology Highlights

  • Turnkey flex solutions targeting 3D miniaturization
  • Highly reliable, extremely robust multilayer flex/microvia substrates
  • Wraparound boards
  • A wide variety of surface finishes, for example OSP, ENIG, ENEPIG
  • Flying leads
  • Bending test for flexible circuits
  • Ultra high-density flex cables
  • Filled via and stacked via process available
  • Complex mechanical and assembly assist features:
    • thinned bending zones in flexible regions
    • special profiles
    • fold lines
    • cutouts
    • cavities in flex or grooves

General capabilities for flex circuit boards:

Description Standard Capability
Lines/spaces (5 µm copper)
45/45 µm
Microvia/pad diameter
75/250 µm
Material thickness, dielectric/copper
25/8 µm
Conductor width tolerance
+/- 20%
Via /layer and layer/layer tolerance
50 µm

Description Leading-Edge Capability
Lines/spaces (5 µm copper)                        
20/30 µm
Microvia/pad diameter 40/150 µm
Material thickness, dielectric/copper 25/5 µm
Conductor width tolerance +/- 20 %
Via/layer and layer/layer tolerance 20 µm
Layer count 10