The production facilities at DYCONEX are designed to manufacture any type of high-end HDI (high-density interconnect) PCB with superior quality and to allow the highest degree of flexibility in build-ups as well as process flows.
Every process module is set up as an independent work center within our production area. The most critical process steps (lithography, lamination, solder masking) are performed in a high-end clean room environment.
To master the extreme level of complexity in our production line we employ a highly sophisticated IT infrastructure. Full traceability is guaranteed from the lot level down to the individual print on a panel as well as for all base materials used.
The transition from prototypes to volume production is a seamless process because we perform all development activities on the target equipment. We thereby avoid the use of lab or bench equipment during the initial phase of a product ramp-up.
Our employees represent a balanced mix of culture, age, gender, skill and expertise with one common goal:
Provide our customers with the world's most reliable PCBs.
© 2013 Micro Systems Technologies, CH-6341 Baar, Switzerland
DYCONEX AG, CH-8303 Bassersdorf, Switzerland