FACTS & FIGURES

Established 1991
Headquarters Bassersdorf/Zurich, Switzerland
Manufacturing area 6000m2, including 600m2 of clean room (ISO class 7: 10'000ft3)
Employees 186
Engineering 31
Production
 133
Products









 Flex, rigid-flex and rigid PCBs
Core capabilities:
  • High density and ultra-high-density interconnect
  • Microvia technologies
  • Multilayer PCB
  • RF flex printed circuit (also using LCP)
  • Hight temperature and high reliability solutions
  • Microfluidic substrates
  • Semiconductor substrates
Principal application sectors Medical, Defense, Aerospace, Industrial, Semiconductor, Packaging, Telecom
Main export market USA, Europe, Asia, Australia
Management Michael Fink, Reinhard Düregger, Jeannine Roth, Gloria Müller
ISO ISO 9001 since 1993
Standards & Compliance MIL-P55110 Type 1-3, GF and GI, MIL-P-50884 Type 1-5, Defense Standard 59-59, UL94 and UL796, International Traffic in Arms Regulations (ITAR) Compliance

Membership

 IPC, IMAPS, EIPC, ZVEI, EITI, FED, iNEMI
Collaboration with several European research institutes