FACTS & FIGURES

Established 1991
Headquarters Bassersdorf/Zurich, Switzerland
Manufacturing area 6000m2, including 600m2 of clean room (ISO class 7: 10'000ft3)
Employees 186
Engineering 31
Production
 126
Products









 Flex, rigid-flex and rigid PCBs
Core capabilities:
  • High density and ultra-high-density interconnect
  • Microvia technologies
  • Multilayer PCB
  • RF flex printed circuit (also using LCP)
  • High temperature and high reliability solutions
  • Microfluidic substrates
  • Semiconductor substrates
Principal application sectors Medical, Defense, Aerospace, Industrial, Semiconductor, Packaging, Telecom
Main export market USA, Europe, Asia, Australia
Management Dr. Hubert Zimmermann, Jeannine Roth, Gloria Müller
ISO ISO 9001:2008 since 1993, ISO 13485:2003
Standards & Compliance MIL-P55110 Type 1-3, GF and GI, MIL-P-50884 Type 1-5, Defense Standard 59-59, UL94 and UL796

Membership

 IPC, IMAPS, EIPC, ZVEI, EITI, FED, iNEMI
Collaboration with several European research institutes