News & Events

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08.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG, an MST company and the world's leading supplier of highly complex solutions in the area of interconnect technology, has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

MST at MD&M West Anaheim 2017

MD&M West

Medical Design & Manufacturing
February 7 - 9, 2017
Convention Center Anaheim, CA, USA
Hall E, Booth# 510

MST at IMAPS Device Packaging 2017 - USA

IMAPS
Device Packaging
March 7 - 8, 2017
We-ko-Pa Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Booth# 14


Showcases

Flex

FPC for medical implants

Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties.

Rigid-Flex

Rigid-flex PCB for 3D miniaturization

In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.

Rigid

High performance rigid PCB

Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.

packagingsubstrates

Advanced packaging substrates

DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array), CSP (chip scale package) and MCM (multichip module).