News & Events

1802_FTS-AGV_208
01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

DYCONEX at PCB West 2018

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PCB Industry
September 12, 2018
Convention Center, Santa Clara, CA, USA
Booth# 203

DYCONEX at Electronics System-Integration Technology Conference 2018 (ESTC)

estc_logo

Conference on electronics and systemintegration technology
September 18 - 20, 2018
The Westin Bellevue Hotel, Dresden, Germany

Presentation by Dr. Eckardt Bihler 
Hermetic LCP modules with NFC communication

DYCONEX at European Microwave Week 2018

EuMweek

Europe's Premier Microwave, RF, Wireless and Radar Event
September 25 - 27, 2018
Ifema Feria de Madrid, Spain
Hall 9, Booth# 220


Showcases

Flex

FPC for medical implants

Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties.

Rigid-Flex

Rigid-flex PCB for 3D miniaturization

In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.

Rigid

High performance rigid PCB

Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.

packagingsubstrates

Advanced packaging substrates

DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array), CSP (chip scale package) and MCM (multichip module).