Semiconductor technology

The core expertise of the MST Group within the semiconductor industry lies in the area of ASIC design and test but also in semiconductor packaging.

In conjunction with the development and manufacture of electronic modules for implants in the fields of CRM (cardiac rhythm management) and neurostimulation, we offer the design of application-specific ICs (ASICs).

ASIC design

  • ultra low power
  • high voltage
  • mixed signal
  • digital / memory / RF
  • sensors

ASIC test and reliability checking

  • automatic wafer probes with temperature testing
  • automatic optical wafer inspection
  • memory, digital and mixed mode tests
  • BGA (ball grid array), CSP (chip scale packaging) and bare wafer testing and handling
  • failure analysis
  • medical-grade reliability assurance
  • yield management

Foundry management

  • cooperation with various strategic partners
  • proven advanced foundry technologies
  • rapid development process
  • complete turn key service

Semiconductor packaging
Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Materials

  • LTCC
  • Al2O3
  • PCB

I/O configurations

  • ball grid array
  • land grid array
  • castellation
  • single in-line / dual in-line
  • quad flat packages

Housings

  • non-hermetic housings using coatings with organic materials
  • hermetic housings by soldering

For further information or to ask us to help you work out a specific solution, please get in touch with us.


ASIC design and semiconductor packaging

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