The core expertise of the MST Group within the semiconductor industry lies in the area of ASIC design and test but also in semiconductor packaging.
In conjunction with the development and manufacture of electronic modules for implants in the fields of CRM (cardiac rhythm management) and neurostimulation, we offer the design of application-specific ICs (ASICs).
ASIC test and reliability checking
Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.
For further information or to ask us to help you work out a specific solution, please get in touch with us.
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