Interconnect technology & electronic manufacturing services (EMS)

The MST Group has extensive experience in designing and manufacturing complex, miniaturized electronic modules for medical devices and other high-reliability applications.

Our core areas of expertise for manufacturing an electronic module include:

Advanced assembly technologies

• automated SMD assembly
• flip chip and chip scale packages
• wire bonding technologies
  - ultrasonic bonding
  - thermosonic wedge/wedge bonding
  - thermosonic ball/wedge bonding
• die attach technologies
  - gluing
  - soldering
  - AuSi eutectic bonding
• die protection and encapsulation

Printed circuit boards and chip packaging substrates

• highly complex HDI/microvia substrates in flex. rigid-flex and rigid technology
• high-frequency and high-temperature applications
• microfluidic substrates
• comprehensive range of base materials, constraining materials and surface finishes
• enhanced features such as embedded passives, wrap-around, cavities
• chip-on-flex (COF) and chip scale packaging (CSP) substrates
• LCP (Liquid Crystal Polymer) substrates

LTCC (low temperature co-fired ceramic) substrates

• stacking of 2 layers up to more than 20 layers
• embedding of passive components such as capacitors, inductors and resistors
• mounting of frames, metal plates or pins by soldering
• mechanical processing by laser cutting or machining

Test services
The MST group has a wide range of test technologies available to demonstrate the required performance of components, sub-assemblies or modules.

For further information or to ask us to help you work out a specific solution, please get in touch with us.