News

10/21/13

DYCONEX invests in Orbotech LDI equipment

In the first half of 2013 DYCONEX AG invested into several pieces of equipment that will further enhance production technology providing optimized PCB solutions for customers.
The purchase of the field-proven Orbotech ParagonTM-9800 Laser Direct Imaging (LDI) system - as the third LDI system in production - is another step in pursuing our strategy to convert all exposure jobs to direct imaging.


09/26/13

VascoMed weiter auf Wachstumskurs

Die VascoMed GmbH mit Hauptsitz in Binzen überschreitet im September 2013 erstmals die 200-Mitarbeiter-Marke. Damit hat das Unternehmen seine Mitarbeiterzahl in den letzten sechs Jahren nahezu verdreifacht.


07/26/13

Sorin CRM names DYCONEX as the 2012 Supplier of the Year

The Sorin Group Cardiac Rhythm Management Business Unit (Sorin CRM) has honored DYCONEX as the best supplier for printed circuit boards in 2012. The prize was handed over in mid June 2013 as part of the annual supplier event in Clamart, France.


06/27/13

DYCONEX implements Electronic Failure Catalog (EFC) with customer log-in

The newly implemented electronic failure catalog enables DYCONEX and its customers to use the same criteria for visual inspection of PCBs - either during in-process or final inspection at DYCONEX, or during incoming inspection at its customers' facilities. The goal is to synchronize inspection processes and outcomes for specific products with the intention of achieving dock-to-stock delivery.


12/04/12

Micro Systems Technologies opens sales office in Singapore

The Micro Systems Technologies Group (MST) has just opened a sales office in Singapore in September of this year. With this new branch office, existing customers in the Asia/Pacific region will be better served, and it will also be possible to meet the increasing demand in this region for innovative solutions from the MST Group.


08/27/12

Micro Systems Technologies strengthens its US sales force

The Micro Systems Technologies (MST) group, a global provider of innovative components and manufacturing services for the medical device industry has experienced strong market growth in recent years. The group's customer focused strategy and growing demand have resulted in a decision to expand the US sales force. MST is pleased to welcome Peter Putnam to the company.


08/24/12

Change of Address for Micro Systems Technologies, Inc.

Micro Systems Technologies, Inc., the US sales and application engineering organization of the Micro Systems Technologies group has moved its Arizona offices to a new location.


08/23/12

Micro Systems Engineering, Inc. accomplishes ISO 13485 certification

Micro Systems Engineering, Inc. (MSEI), an MST company and a leading specialist in the development and manufacture of electronic modules for active implants, has been successfully certified according to EN ISO13485:2003, the international standard for quality management systems for medical devices.


07/23/12

DYCONEX achieves ISO 13485 certification

We are pleased to announce that DYCONEX has been awarded ISO 13485:2003 certification. The ISO 13485 standard complements DYCONEX's existing ISO 9001 Quality Management System, that the company has maintained for many years and documents DYCONEX's capabilities as a supplier of high quality and reliability components to its customers in the medical market.


07/05/12

Micro Systems Technologies & DYCONEX AG announce changes in management structure

The Micro Systems Technologies (MST) Group (Baar, Switzerland) and DYCONEX AG (Bassersdorf, Switzerland) are pleased to announce important changes in their management structure.


05/22/12

DYCONEX is rated as a No. 1 company by Dun & Bradstreet

Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence.

We are pleased to announce that in March 2012, DYCONEX AG was awarded a No. 1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.


05/22/12

DYCONEX demonstrates 20-µm line & space capability on multilayer LCP product

DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates.


02/03/12

LITRONIK puts automated cathode press into operation

By the end of 2011, LITRONIK Batterietechnologie GmbH put into operation an automated cathode press for cathodes manufacturing of medium rate batteries. This innovative technology minimizes the number of necessary steps during cathode manufacturing and considerably reduces manual efforts compared to previous processes. After having experienced very positive results in daily practice, the stated goal is in future to expand the application of this technology to high power batteries which will completely replace current manufacturing processess for this battery segment.


05/26/11

DYCONEX joins PhasedCom Eurostars project consortium

DYCONEX has joined the PhasedCom Eurostars project consortium that has started the development of an innovative shaped (non-planar) antenna based on novel, low cost, phased array technology.


11/01/10

Micro Systems Technologies, Inc.

We are pleased to announce the foundation of Micro Systems Technologies, Inc. MST, Inc. has been evolved from the former DYCONEX, Inc. and is headquartered in Mesa, Arizona.


09/15/10

LITRONIK puts new laser welding robot into operation

Since mid September 2010, a powerful laser welding robot has expanded the capabilities of the fabrication lines at LITRONIK Batterietechnologie GmbH in Pirna, Germany. Using a partially automated process, the new robot creates very high quality welding seams in an efficient way. With this new process, housings and lids are welded together to make LITRONIK medium-rate and high-power batteries intended for use in pacemakers and implantable defibrillators.


09/01/10

New packaging line at Micro Systems Engineering GmbH (MSE) in Berg, Germany

By the end of 2011, MSE plans to invest 1.8 million Euros in a new packaging line. This investment is an integral part of the development project to introduce the fabrication of transfer-molded stacked die BGAs (SDBGAs) at MSE.
SDBGAs are highly integrated components that consist of two or more individual chips stacked on each other and that can be handled with surface mount technology.
With this project, MSE gives its customers access to this technology even for applications whose parts counts lie far below the multi-million level otherwise required.


08/30/10

DYCONEX invests into state of the art IST HC test equipment

As a leading supplier of high-end, high quality flex printed circuits of active implantable devices, hearing-aid and other sophisticated medical applications, DYCONEX has now further enhanced its qualification testing capability by purchasing the latest model IST HC (Interconnect Stress Test, High Capacity) test equipment supplied by PWB Corporation. This latest in a series of capital equipment investments shall prove very useful in preparing for the qualification of future medical device generations as well as to validate new production processes and base materials.


03/22/10

VascoMed receives Jobmotor Award

On Friday, March 19, 2010 the Jobmotor Prizes for the year 2009 were awarded to the fastest growing companies of South Baden (Baden-Wuerttemberg, Germany) in
the historic Meckel Hall Freiburg/Breisgau.