News & Events

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12.05.2016

DYCONEX celebrates its 25th anniversary

DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.

28.04.2016

MST strengthens its sales force in Israel with E.D.E. Electronics as representative

The Micro Systems Technologies Group (MST) is pleased to welcome E.D.E. Electronics Ltd. as new representative in Israel.

Micro Systems Engineering GmbH (MSE) at European Microwave Week 2016

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Microwave, RF, Wireless & Radar
October 4 - 6, 2016
ExCel London, UK
Booth# 71

MST at International Symposium on Microelectronics 2016 - USA

IMAPS
Microelectronics
October 11 - 12, 2016
Convention Center, Pasadena, CA, USA
Booth# 123

DYCONEX & Micro Systems Engineering GmbH (MSE) at electronica 2016

electronica

Electronic Components, Systems and Applications
November 8 - 11, 2016
Messe München, Germany
DYCONEX: Hall C4, Booth# 610
Micro Systems Engineering GmbH: Hall C4, Booth# 401

MST at COMPAMED 2016

COMPAMED

High tech solutions for medical technology
November 14 - 17, 2016
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at IMAPS Technology Workshop Lyon 2016 - France

IMAPS
Microelectronics, Systems & Packaging
December 7 - 8, 2016
Metropole Hotel, Lyon, France

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.