Micro Systems Technologies

Our comprehensive solutions, services and components are used first and foremost in medical technology, especially in active implants. However, other high-tech industries also count on our innovative products and longtime experience.
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Micro Systems Technologies

The globally active MST Group consists of five technology companies with many years of experience:
DYCONEX AG,
LITRONIK Batterietechnologie GmbH,
Micro Systems Engineering GmbH,
Micro Systems Engineering, Inc.,
VascoMed GmbH.
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Micro Systems Technologies

The spectrum of technologies within the MST Group is extremely wide. Among the core areas of expertise at MST are interconnect technology and EMS, semiconductor packaging processes, ASIC design and test, battery technologies, hermetic feedthroughs as well as catheter technology.
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News & Events

03.02.2012

LITRONIK puts automated cathode press into operation

By the end of 2011, LITRONIK Batterietechnologie GmbH put into operation an automated cathode press for cathodes manufacturing of medium rate batteries. This innovative technology minimizes the number of necessary steps during cathode manufacturing and considerably reduces manual efforts compared to previous processes. After having experienced very positive results in daily practice, the stated goal is in future to expand the application of this technology to high power batteries which will completely replace current manufacturing processess for this battery segment.

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2012 - Scottsdale, USA

IMAPS
Device Packaging
March 6 - 7, 2012
Radisson Fort McDowell Resort & Casino, Scottsdale/Fountain Hills, AZ, USA
Booth# 20

MST at MEDTEC Europe 2012

MEDTEC Europe
Leading European trade show for medical manufacturing industry
March 13 - 15, 2012
Messe Stuttgart, Germany
Hall 2, Booth# 2508

Careers

Careers

Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.

Catheter and catheter systems

Catheters and catheter systems

Electrophysiological diagnostics, temporary cardiac stimulation, catheter ablation, lead extraction and neurology are among the fields of application for our innovative catheters and catheter systems.