Micro Systems Engineering GmbH (MSE)

For 30 years, MSE has specialized in customer-specific solutions in microelectronics. The company belongs to the leading European suppliers of complex LTCC (low temperature co-fired ceramic) substrates as well as board-assembly and semiconductor-packaging technologies for both ceramic and organic substrates.

The manufacturing of electronic modules for active implants has been one of the most important business segments for MSE since it was founded. The company also applies the expertise and experience it has gained in medical technology every place where high reliability, miniaturization, high temperatures, high frequencies or hermetic encapsulation play an important role. Examples include projects in telecommunications, aerospace and industrial electronics.
Based on customer-specific requirements, MSE offers all the key processes needed to manufacture an electronic module from one source:

  • design service for ceramic and organic substrates, as well as others such as thin film, DCB, etc.
  • substrate manufacturing: LTCC (low-temperature co-fired ceramics), thick film
  • board-assembly processes such as SMT, flip chip, wire bonding, die attach, etc. on any base materials
  • packaging processes for BGA (ball grid arrays), LGA (land grid arrays), QFP (quad flat packages), etc.
  • special services including customer-specific tests, project management, validation, materials procurement on a worldwide basis, etc.

The most modern production lines, extensive test and inspection facilities, 100 percent traceability for processes and materials all taken together guarantee top-level solutions in microelectronics.
MSE is ISO 13485 and ISO 9001 certified.

MSE has its headquarters, with roughly 200 employees, in Berg (Upper Franconia), roughly 60 km north of Bayreuth, Germany. The facility located there has a total floor space of 5'500 m2.


Micro Systems Engineering GmbH
Schlegelweg 17
DE-95180 Berg
Germany

Tel. +49 (9293) 78-0
Fax +49 (9293) 78-41
info.msegmbh@mst.com

Manufacturing of electronic modules